Manufacturers are slowly departing from the 2D NAND. According to DigiTimes, memory-producing companies will be building more 3D NAND in the coming months. For entities it is important primarily because of the savings resulting from using the new technique. In addition, they are able to produce larger bones, and the need for space for data is constantly increasing.
DigiTimes says that in the fourth quarter of this year, 3D NAND production will be higher than standard 2D NAND designs. Samsung, Micron and Toshiba will offer 64-layer memory, while Hynix will use the recently developed 72-layer chips. All players should increase production, so that the supply of flash memory should improve.
Production problems are not the major concern for Samsung. The company has a very stable position and solid revenue from the memory segment. Koreans are going to gradually increase the supply of 3D NAND systems since May this year. In addition, a new facility in Pyeongtaek will be opened in July, which will provide even better production possibilities for memory bones.
DigiTimes also adds that other manufacturers should not be lagging behind Samsung. Micron will begin mass production of 64-ply NAND 3D chips in the second quarter of this year to meet demand in the second half of this year. Hynix has already announced the opening of a new factory, and for Toshiba, the investment in memory segment development is key to the company’s survival.